ZutaCore has officially detailed a new two-phase boiling technology designed for integration into its ultra-thin cold plates. This development aims to advance liquid cooling solutions within data center environments, addressing the thermal management demands of high-density hardware.
By utilizing two-phase boiling, the company’s technology is engineered to manage the heat generated by power-intensive computing components more effectively than traditional methods. The implementation of this boiling design within an ultra-thin form factor is intended to facilitate easier deployment within existing server architectures while maintaining cooling performance.
The announcement underscores the industry’s ongoing shift toward liquid cooling as a standard for high-performance computing and data center infrastructure. Further specifications regarding the thermal capacity and compatibility of these new cold plates were part of the technical details provided by ZutaCore.
Source: Data Center Dynamics
Original article: https://www.datacenterdynamics.com/en/news/zutacore-details-new-two-phase-boiling-technology-for-liquid-cooled-data-centers/
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